Traditionally, infrared focal plane arrays (FPA) have been composed of an infrared sensor array that is indium bump bonded to a CMOS readout integrated circuit. With the advent of vertical integrated sensor array (VISA) technology, a focal plan array can be integrated with readout electronics, A/D converters and digital signal processing to achieve both a high dynamic range and a high frame rate. However, the A/D converters and digital signal processing must fit within the same the two- dimensional area as the sensor array and the total power consumption is constrained by cooling considerations and the thermal expansion that can be tolerated in the layers of the vertically integrated structure.
In this research, the tradeoffs among area, power, and sampling rate and number of converters in the A/D converter system for VISA technology are being investigated with regard to both system architecture and circuit implementation.
Integrated Circuits Lab
Center for Integrated Systems
Stanford University